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Kevin T. TurnerKevin T. Turner - Kevin T. Turner is the Gabel Family Term Associate Professor of Mechanical Engineering and Applied Mechanics and director of the Wolf Nanofabrictaion Facility at the University of Pennsylvania. Prior to joining the Penn in August 2011, he was on the faculty of the Department of Mechanical Engineering at the University of Wisconsin-Madison for six years. He received a B.S. degree in mechanical engineering from the Johns Hopkins University in 1999 and S.M. and Ph.D. degrees in mechanical engineering from the Massachusetts Institute of Technology (MIT) in 2001 and 2004, respectively. His research spans multiple topics including, wafer bonding, tip-based nanomanufacturing, microfluidics, and transfer and integration of semiconductor nanomembranes.

3D Stacking via Transfer Printing and Wafer Bonding: Interface and Process Mechanics

Transfer printing and wafer bonding processes are enabling technologies for the fabrication of 3D devices, including advanced nanoelectronics, optoelectronics, and MEMS. Realizing the full potential of these 3D stacking technologies requires an understanding and control of the mechanics of the processes. Process mechanics governs success of failure in bonding and transfer, impacts achievable layer-to-layer alignment, and controls residual stresses in the fabricated structure. This talk will describe routes for advanced device fabrication via aligned stacking and will describe our efforts to understand and exploit the mechanics of transfer printing and wafer bonding processes. Specifically, the talk will cover the direct adhesion of silicon components at room-temperature, mechanics-based process models that can be used to guide the development of transfer printing and bonding processes, and a discussion of the role of mechanical deformation in later-to-layer alignment.
Workshop Sponsors
NSF      WIMS2      Freescale      TRF
Marketing Partners

MEMS Industry Group (MIG)    Roger Grace Associates

Additional Funding Provided by MEDC